(4/5) based on 17 customer reviews
Description
Apr 1, 2014 MicroFET Leadframe, the FDMB2307NZ minimizes both PCB space and rS1S2( on). Application. Li-Ion Battery Pack. MLP 2x3. S1. S2. G1. Aug 9, 2014 FDMB2307NZ . 6-MLP 3X2 (TFNiPdAu). CuLF. INTERNAL PENANG. 0.015200 g. Each. Terminal Finish. Base Alloy. J-STD-020 MSL Rating. Jul 14, 2015 FSID. Material Declaration. Site Owner. Assembly. Location. Package. Weight(g). MSL. Rating. FDMB2307NZ . MLP-6 (TFNiPdAu) CuLF. FSPM. Handling Procedures. Reel No.: ESD Logo Label sample. ESD Logo Label. F63TNR Label. LOT: PMH010088888. FSID: FDMB2307NZ . D/C1: P1051AA QTY1:.
| Part Number | FDMB2307NZ |
| Main Category | Discrete Semiconductor Products |
| Sub Category | Transistors - FETs, MOSFETs - Arrays |
| Brand | Freescale |
| Description | MOSFET 2N-CH 6-MLP |
| Series | PowerTrench |
| Packaging | Tape & Reel (TR) |
| FET Type | 2 N-Channel (Dual) Common Drain |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | - |
| Current - Continuous Drain (Id) @ 25°C | - |
| Rds On (Max) @ Id, Vgs | - |
| Vgs(th) (Max) @ Id | - |
| Gate Charge (Qg) (Max) @ Vgs | 28nC @ 5V |
| Input Capacitance (Ciss) (Max) @ Vds | - |
| Power - Max | 800mW |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 6-VDFN Exposed Pad |
| Supplier Device Package | 6-MLP (2x3) |
| Image |  |
FDMB2307NZ
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Yingxinyuan INT'L (Group) Limited
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Finestock Electronics HK Limited
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