Freescale

Description

SAC 105 , CuPd Wire. MSL3, 260 C Reflow. ASE-Taiwan (G). FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT reliability@cypress.com or via a Package Qualification Report. QTP# 123401 VERSION*D. October 2014. 60 & 70 UFBGA (5.5x5.5x0.6mm). 84 UFBGA (6x6x0.6mm). SAC105 , MSL3, 260 C using 0.8mil CuPd wire with GR9810 mold compound, QMI-506 die attach material and SAC-105 ball finish at MSL3, 260C Reflow. Temperature. July. 2015 Aug 26, 2016 84 TFBGA 6x6x1.0 SAC105 . Basic Substance. CAS Number. Contained In. Sub -Component. % Total. Weight mg/part ppm. 64.60. (mg) Total. Aug 26, 2016 Compliant with IEC 62474/ D9.00. Compliant to IEC 61249-2-21:2003. Semiconductor Device Type: 7GX. 169 TFBGA 10x10x1.1mm SAC105 .